Job Description
To apply for this job, you need to complete both steps below:
STEP 1:
Please click the link to submit your application directly to the company:
Technical Intern, IC Package Design Engineer in Ho Chi Minh City, SG, Vietnam
Your application will only be received by Recruiter if submitted via above link.
STEP 2:
Kindly scroll to the bottom of this page and complete the short VinUni Tracking Form.
Filling out this form alone does not count as applying. Kindly remind this form is not part of the company’s application process. It only helps Careers, Alumni, Industry and Development (CAID) Department discover more opportunities and follow up in case of system issues.
About the role
- You will be a part of the Package and Systems Engineering Team, which is responsible for the design and development of a variety of high-performance semiconductor IC (Integrated Circuit) packaging solutions for the latest ARM-64bit Server Technology Chip production. You will work with Package and PCB layout teams, Signal and Power Integrity teams to verify signal characteristics and optimize signal routing and power delivery networks. You will set your own limits for learning and achievements.
- You will have an opportunity to work collaboratively with and learn from veteran industrial designers and architects and to contribute to breakthrough designs for cloud computing. Our engineers are excited about technology and innovation, and channel that energy to deliver world-class products.
- Technical Intern, Package Design Engineer needs to have solid knowledge of electric circuits/electronics/micro-electronics and electromagnetic field theory, particularly as it relates to high-speed signal propagation and power delivery. Understanding common electrical interfaces such as I2C, SPI, UART, as well as common electrical circuits, such as Operational Amplifiers, LDOs, Bulk, Boost switching voltage regulators is an advantage. In addition, knowledge in the fields of Signal Processing and Digital Communications would be useful for troubleshooting and understanding the behavior seen in simulation results.
What you’ll achieve
- Post-layout simulation for power integrity and signal integrity.
- Work with layout routing adjustments and passive component selection.
- Collaborate with Silicon Engineering/ Hardware Platform Engineering to achieve optimal performance for silicon, IC packages, and platforms.
About you
- Experience with some hardware projects (Circuit/PCB design and simulation) at your school is preferred.
- Experience and/or knowledge in microprocessor and communication system development.
- Experience and/or knowledge in power regulator design, simulations, and measurements; characterizing the power rail is a plus.
- Knowledge and experience with Allegro PCB Design/Simulation tools are preferred.
- Good communication skills in English and Vietnamese
Education
- Candidate must be pursuing a Bachelor’s Degree in Electrical & Electronic Engineering, Computer Engineering as the 4th year Students with strong academic record or equivalent.
What we’ll offer
At Ampere we believe in taking care of our interns and providing a competitive monthly stipend and allowance.
Benefits highlights include:
- Mentorship and on-the-job training from industry experts
- Daily catered lunch, a variety of snacks, energizing coffee or tea, and refreshing drinks to keep you fueled and focused throughout the day.
- Intern events, cultural and engagement activities with the team and the company

