DRÄXLMAIER Group | Maintenance Intern

Da Nang

Intern

08/04 — 18/04/2026

Job Description

To apply for this job, you need to complete both steps below:

STEP 1:

Please click the link to submit your application directly to the company: 

https://www.linkedin.com/jobs/view/4395964795/

Your application will only be received by Recruiter if submitted via above link. 


STEP 2:

Kindly scroll to the bottom of this page and complete the short VinUni Tracking Form.

Filling out this form alone does not count as applying. Kindly remind this form is not part of the company’s application process. It only helps Careers, Alumni, Industry and Development (CAID) Department discover more opportunities and follow up in case of system issues.

Objective of Job

  • Support the design and the implementation of basic production equipment

Principle Activities

  • Support the design of tools and equipment
  • Support the implementation of tools and equipment
  • Support the creation of procurement documents tool and equipment
  • Support the conduction of machine approvals, support the determination of machine capabilities (MFU)
  • Support technical release of basic equipment for production
  • Conduct calculations as required

Requirements

  • Specialist knowledge: Graduated from a college or university in fields related to mechanics, mechanical engineering, electrical engineering, or electronics
  • Proficient in using AutoCAD
  • Type of activities: Predominantly similar tasks with several potential solutions, including occasional analysis of the situation/causes
  • Scope: Standardized procedures and processes, and general work instructions; progress is monitored at shorter intervals

We offer

  • Internship allowance during the internship period
  • Accident insurance during the internship period
  • Working time: 45 hours/week (Monday – Friday)
  • Free lunch, Shuttle bus routes: Da Nang – Tam Ky, Quang Ngai – Tam Ky
  • Participation in company activities such as the annual teambuilding, year‑end party, and other team‑bonding events

Application form

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